NASA 1996 SBIR Phase I

PROJECT TITLE : Bendable Integrated Circuits for Conformal Multi-Modular Packaging

TECHNICAL ABSTRACT (LIMIT 200 WORDS)

A novel packaging technique to allow integrated circuits to conform to the external shapes is proposed. Circuits are thinned to a level where silicon can be bend without breaking and bonded to a flexible backing material. Any circuit with various technology origin and complexity can be joined on the same backing substrate. Off-the-shelf components can be used without any design modification, lowering the cost and enhancing the manufacturability. The resulting package will have enhanced high frequency characteristics due to removal of the substrate parasitics. This novel packaging approach will allow to place complex circuitry on the walls of small enclosures such as microspacecrafts and microprobes.

Flexible circuits can be used where space is premium and odd shapes needs to be maintained. Roll-up displays, wrist- worn electronic products, shape conforming sensors, flexible smart cards are among many products that can benefit directly. Furthermore, the thinning allows the removal of mass, thus enhancing radiation tolerance, ruggedness under extreme acceleration and increases high frequency performance especially for ultra light weight portable personal communication devices.

Volkan Ozguz
IRVINE SENSORS CORPORATION
3001 REDHILL AVENUE
BUILDING #3
COSTA MESA, CA 92626

IRVINE SENSORS CORPORATION
3001 REDHILL AVENUE
BUILDING #3
COSTA MESA, CA 92626